SMT stencil wipe roll uses natural wood pulp and polyester fiber as raw materials, and is processed by spunlace method, forming a unique wood pulp/polyester double-layer structure. It is a special wiping paper for SMT printing of circuit boards in electronic industry, which can effectively remove excess solder paste and red glue adhered to the steel mesh and circuit boards of the printing press, and keep the circuit boards spotless, thus effectively reducing the rejection rate and effectively improving the production efficiency and product quality.